Electronics Packaging

It’s a fact: the higher the PCB (Printed Circuit Board) temperature, the lower the electrical performance of an electronic device. With electronic component and power density on present-day PCBs being higher than ever, it's difficult for a PCB designer to ignore thermal effects. Thermal analysis assists the designer in determining the electrical performance of the components on the PCB, and it also helps the designer determine if the component or PCB will burn up due to high temperatures.
Natural or forced convection from the front and back surfaces, conduction from the edges of the PCB to walls of an electronics box, conduction through rigid or flexible connectors to other PCBs,
conduction from PCB to mounting frame and conduction to heat sinks are just some of the scenarios that can be analyzed using NISA. The NISA product line has been helping the electronics industry for the last two decades in designing and analyzing safe and efficient products

NISA Solutions for Electronics

  • Solid modeling
  • FE mesh generation
  • Analysis of parasitic inductances and capacitances
  • Shock and vibration analysis
  • Solder analysis
  • Humidity analysis
  • PCB coating analysis
  • Stress analysis
  • Composite material analysis
  • Fatigue analysis
  • Thermal analysis
  • CFD
  • Electromagnetic analysis
Amstrup-Engineering |  mail@a-engineering.dk | +45 61 33 78 07